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Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance

Loudi Antaeus Electronic Ceramic Co.,Ltd.
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    Buy cheap Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance from wholesalers
     
    Buy cheap Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance from wholesalers
    • Buy cheap Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance from wholesalers

    Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance

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    Brand Name : Antaeus
    Model Number : AD-B028
    Certification : /
    Price : Negotiation
    Payment Terms : T/T or Negotiation
    Supply Ability : Full Supply
    Delivery Time : 15-45 days
    • Product Details
    • Company Profile

    Insulated Al2O3 Alumina Ceramic Rings O Shape High Temperature Resistance

    Alumina Seal Ceramic Rings / Industry Insulation Rings


    1. Description:

    Material analysis and comparison

    The MCH heating sheet is a high-temperature co-fired multilayer metal-ceramic composite material. The heating metal paste layer is printed on the alumina ceramic green body as the insulating medium, and then another alumina ceramic green body is laminated on it. Co-fired into one. From the perspective of heating principle, the heating principle of MCH is metal tungsten conduction, and the high electrothermal conversion efficiency of metal tungsten is recognized. The nature of metal conduction is free electron conduction, and the outer layer of metal atoms has fewer electrons. After being combined into structural elements, atomic There are still more electron vacancies in the outer layer, which can accommodate foreign electrons to enter and move, so it is easy to conduct electricity.

    PTC is essentially a semiconductor material. The principle of energization and heating is that a certain number of free electrons are formed by semiconductor doping. PTC is made of barium titanate as the matrix and doped with other polycrystalline ceramic materials, which has a low The resistance and semi-conductivity characteristics.

    2. Feature Advantages:

    1) Refractory, High Temperature Resistance, Maximum Used Temperature: 1800 ºC (3272ºF)
    2) Hardness Strength, Wear Resistance Up To Mohz 9.0 ; HRA 80-90
    3) High Voltage, Good Insulation Performance ,Electrical Resistivity Up To 10∧14 Ohm.Cm
    4) High Polished Surface Up To Rz0.8(Ra0.1)
    5) Superior Mechanical Strength, MAX 10 MPa.m1/2 Fracture toughness
    6) Pressure Resistance, Max 2300MPa compressive strength
    7) Anti-High Corrosion Resistance, Such As Acid Alkali Resistance
    8) Long Service Life
    9) Other excellent property


    3. Material Features / Properties:

    Composite(wt %)99%99.5%99.8%
    ColorWhite or IvoryWhite or IvoryWhite or Ivory
    Densityg/cm 33.823.93.92
    HardnessHRA838585
    Flexural StrengthMpa (psi*10 3 )375386381

    4. Technical Parameters:

    Technical Parameters of Ceramics
    ItemsTest ConditionsUnit or Symbol99% AL2O395% AL2O390% AL2O3ZirconiaSteatiteSilicon Carbide
    Volume Density--g/cm3≥3.70≥3.62≥3.40≥5.90≥2.60≥3.08
    Tightness--Pa·m³/s≤1.0×10-11≤1.0×10-11≤1.0×10-11---
    Liquid Permeability----PassPassPassPass-
    Flexural Strength-MPa≥300≥280≥230≥1100≥120≥400
    Elastic Modulus-GPa-≥280≥250≥220-400
    Poisson Ratio-  --0.20~0.250.20~0.25---
    Thermal Shock Resistance800℃( Room Temperature) Cycle: 10 timesPassPassPass---
    Coefficient of Linear Expansion20℃~100℃×10-6 K-1---≤8-
    20℃~500℃×10-6 K-16.5~7.56.5~7.56.5~7.56.5~11.2--
    20℃~800℃×10-6 K-16.5~8.06.5~8.06.3~7.3-4
    20℃~1200℃×10-6 K-1-7.0~8.5----
    Coefficient of Thermal Conductivity20℃W/(m·k)-----90~110
    1000℃
    Dielectric Constant1MHz 20℃-9.0~10.59.0~109.0~10-≤7.5-
    1MHz 50℃--9.0~10----
    10GHz 20℃-9.0~10.59.0~109.0~10---
    Volume Resistivity100℃Ω·cm≥1.0×1013≥1.0×1013≥1.0×1013-≥1.0×1012-
    300℃≥1.0×1013≥1.0×1010≥1.0×1013---
    500℃≥1.0×109≥1.0×108-----
    Disruptive StrengthD.CkV/mm≥17≥15≥15-≥20-
    Chemical Durability1:9HClmg/c㎡≤0.7≤7.0----
    10%NaOHmg/c㎡≤0.1≤0.2-----
    Grain Size-μm-3~12----

    5. Process Flows:

    Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing


    6. Production Facilities: Prilling Tower , Forming Machine , High Temperature Sintering Kiln


    7. Detection Devices:

    Electric Performance Tester , Film Thickness Analyzer , Granulometer , Helium Mass Spectrometer Leak Detector , Universal Pull Force Meter


    8. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ; Good Service


    9. Shipping and Package:

    10. Our aimed market:


    Notes:Above information only for reference and please contact with us for more details freely when you have any inquiry!

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