Metallized Alumina Ceramic Insulators / Metallized Ceramic for
Electronics
1. Description:
Ceramic-to-metal bonding has been one of the biggest challenges for
manufacturers over the years because of the inherent differences in
the thermal expansion coefficients of the two types of materials.
By far the most widely preferred and effective method for creating
a leak-tight, robust joint between ceramic and metal is by brazing.
This starts with the chemical bonding metallization of the ceramic
to create a wettable surface on which braze alloy will flow between
the two components during the brazing process.
2. Feature Advantages:
1) High elasticity modulus
2) High compressive strength.
3) Anti corrosion
4) Abrasion resistance
5) Impact resistance
6) High precision
7) High stability
8) Good advanced ceramic materials
9) High welding sealing performance
10) High hardness and high density
11) Low thermal conductivity
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
16) High temperature resistance
17) A variety of specifications is available
18) Satisfy various technical requests
19) Lower medium spoilage
20) Stiffness texture
3. Material Features / Properties:
| Composite | (wt %) | 99% | 99.5% | 99.8% |
| Color | | White or Ivory | White or Ivory | White or Ivory |
| Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
| Hardness | HRA | 83 | 85 | 85 |
| Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
| Technical Parameters of Ceramics |
| Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
| Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
| Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
| Liquid Permeability | -- | -- | Pass | Pass | Pass | | Pass | - |
| Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
| Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
| Poisson Ratio | - | - | - | 0.20～0.25 | 0.20～0.25 | - | - | - |
| Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | | Pass | Pass | Pass | - | - | - |
| Coefficient of Linear Expansion | 20℃～100℃ | ×10-6 K-1 | - | - | - | | ≤8 | - |
| 20℃～500℃ | ×10-6 K-1 | 6.5～7.5 | 6.5～7.5 | 6.5～7.5 | 6.5～11.2 | - | - |
| 20℃～800℃ | ×10-6 K-1 | 6.5～8.0 | 6.5～8.0 | 6.3～7.3 | | - | 4 |
| 20℃～1200℃ | ×10-6 K-1 | - | 7.0～8.5 | - | - | - | - |
| Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90～110 |
| 1000℃ |
| Dielectric Constant | 1MHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | ≤7.5 | - |
| 1MHz 50℃ | - | - | 9.0～10 | - | - | - | - |
| 10GHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | - | - |
| Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
| 300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - |
| 500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - |
| Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
| Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
| 10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - |
| Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding
--- Printing --- Nickel Plating --- Assembing --- Brazing ---
Inspecting --- Packing
6. Production Facilities: Prilling Tower , Forming Machine , High
Temperature Sintering Kiln
7. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer ,
Granulometer , Helium Mass Spectrometer Leak Detector , Universal
Pull Force Meter
8. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ;
Good Service
9. Shipping and Package:
Notes:Above information only for reference and please contact with
us for more details freely when you have any inquiry!
