Electronic Ceramic Components / Ceramic Electronic Parts
1. Description:
Ceramics and glass in electrical and electronic applications ---
Ceramic materials are used in a wide range of applications from
power distribution to smartphones.The nearly $4.5 trillion global
electronics industry would not exist without ceramics.
Ceramic-based components are indispensable in products such as
smartphones, computers, televisions, automotive electronics, and
medical devices.
Feature Advantages:
1) High hardness and high density
2) Low thermal conductivity
3) Chemical inertness
4) Good wear resistance
5) High Fracture toughness
6) Good insulation performance
7) High temperature resistance
8) A variety of specifications is available
9) Satisfy various technical requests
10) Lower medium spoilage
11) Stiffness texture
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
3. Material Features / Properties:
| Composite | (wt %) | 99% | 99.5% | 99.8% |
| Color | | White or Ivory | White or Ivory | White or Ivory |
| Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
| Hardness | HRA | 83 | 85 | 85 |
| Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
| Technical Parameters of Ceramics |
| Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
| Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
| Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
| Liquid Permeability | -- | -- | Pass | Pass | Pass | | Pass | - |
| Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
| Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
| Poisson Ratio | - | - | - | 0.20～0.25 | 0.20～0.25 | - | - | - |
| Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | | Pass | Pass | Pass | - | - | - |
| Coefficient of Linear Expansion | 20℃～100℃ | ×10-6 K-1 | - | - | - | | ≤8 | - |
| 20℃～500℃ | ×10-6 K-1 | 6.5～7.5 | 6.5～7.5 | 6.5～7.5 | 6.5～11.2 | - | - |
| 20℃～800℃ | ×10-6 K-1 | 6.5～8.0 | 6.5～8.0 | 6.3～7.3 | | - | 4 |
| 20℃～1200℃ | ×10-6 K-1 | - | 7.0～8.5 | - | - | - | - |
| Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90～110 |
| 1000℃ |
| Dielectric Constant | 1MHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | ≤7.5 | - |
| 1MHz 50℃ | - | - | 9.0～10 | - | - | - | - |
| 10GHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | - | - |
| Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
| 300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - |
| 500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - |
| Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
| Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
| 10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - |
| Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding
--- Printing --- Nickel Plating --- Assembing --- Brazing ---
Inspecting --- Packing
6. Application Fields:
Widely apply for new energy vehicles, charging piles, solar power
generation, energy storage and power storage system, electric
vehicle power system and so on.
7. Production Facilities: Prilling Tower , Forming Machine , High
Temperature Sintering Kiln
8. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer ,
Granulometer , Helium Mass Spectrometer Leak Detector , Universal
Pull Force Meter
9.Order Flow Steps as belows: Inquiry ---Quotation --- Place an
order --- Production --- Delivery
10. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ;
Good Service
11.Shipping and Package:
12. Our aimed market :
Notes:Above information only for reference and please contact with
us for more details freely when you have any inquiry!
